Heidelberg DWL 200 Laser Lithography System

Description

  • G-line Laser writer with 0.8 µm spot size
  • Up to 8" round or square substrates with thickness up to 1 cm
  • Direct write on uneven substrates up to 100 µm variation in flatness
  • 6 bits grayscale writing for 3-dimensional lithography

Facility