JSW AFTY AFTEX-6200 ECR Plasma Deposition System

Description

  • Load lock style system, capable of holding up to three 100 mm substrates per run with multitasking capability
  • 2 target configuration
  • Currently available target materials (Please inquire about current configuration):
    • Si
    • Al
    • Ta
  • Ultra-high purity O2, Ar, and N2 process gasses
  • Substrate heating up to 400°C
  • Multi-layer deposition, up to a maximum of 22 layers
  • High refractive index control
  • High-reactivity deposition
  • Low-temperature, low-damage deposition with a surface cleaning effect

Restrictions:

  • Photoresist

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