Photolithography Core

The CNSI NCF houses a Class 100 yellow room for basic contact photolithography as well as direct writing of photomasks and substrates via the Heidelberg laser writer. The equipment supports wafers sizes ranging from pieces to 6" diameter.


Precision coat-bake system combines a track-quality precision spin coater with a high-uniformity bake plate.

Direct write lithography tool used as a high resolution pattern generator for photomask fabrication and patterning of substrates.

Nikon Optical Microscope

Contact aligner for broadband lithography. Backside alignment capability.

Wet benches available for solvent, developer, and acid/base processing.

Oxygen plasma cleaning system with downstream and direct plasma cleaning capabilities.