JSW AFTY AFTEX-6200 ECR Plasma Deposition System

Description

• Load lock style system, capable of holding up to three 100 mm substrates per run with multitasking capability
• 2 target configuration
• Currently available target materials (Please inquire about current configuration):
  • Si
  • Al
  • Ta
• Ultra-high purity O₂, Ar, and N₂ process gasses
• Substrate heating up to 400°C
• Multi-layer deposition, up to a maximum of 22 layers
• High refractive index control
• High-reactivity deposition
• Low-temperature, low-damage deposition with a surface cleaning effect

Restrictions

• Photoresist